맥동전류에 의한 구리도금의 수학적 모델링

Mathematical Modeling of Copper Plating with Pulsed Current

a mathematical model is presented to describe the current distribution on a rotaing disk electrode under the galvanostatic pulse conlitions. A numerical technique by finite difference method to the transient convective diffusion equation, coordinate transformation and separation of variables to Laplace equation, and an iterative algorithm to solve the above equations simtltaneously with approximate boundary conditions were developed. An experimental investigated based on copper deposition in a copper sulfate-sulfuric acid system was performed and satisfactory agreement was obtained between expermental and theoretical current distribution. The current distribution of copper deposition is secondary current distribution within the experimental conditions. Dimensionless variables, N and J as well as Wagner number were used to determine the criteria for the uniformity of current distribution.