A Study on the Formation of Interface and the Thin Film Microstructure in TiN Deposited by Ion Plating

이온플레팅에 의한 TiN 증착중 계면형성과 박막 미소조직에 관한 연구

  • 여종석 (서울대학교 금속공학과) ;
  • 이종민 (서울대학교 금속공학과) ;
  • 한봉희 (서울대학교 금속공학과)
  • Published : 1991.06.01

Abstract

Recent studies son surface coatings have shown that the change of physical, chemical and crystallographic structure analysed and observed according to the deposition process variables has the effects on the resultant film properties. Under the same preparation condition conditions of the substrate and process variables, physical morphology variations characterized by substrate temperature and bias which offect the surface mobility of adatom and adhesion variations related to the formation of Ti interlayer were considered in the present study. Microhardness showed the highest value around 40$0^{\circ}C$ of the substrate temperature and increased with the substrate bias. Adhesion was improved with the increase of substrate temperature and bias. An interlayer of pure titanium formed prior to deposition of TiN improves the adhesion at its optimum thickness. These results were explained by the change of physical morphology and phase analysis.

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