Effects of Deposition Parameters on TiN Film by Plasma Assisted Chemical Vapor Deposition(I) -Influence of Temperature on the TiN Deposition-

플라즈마 화학 증착법(PACVD)에 의한 TiN 증착시 증착변수가 미치는 영향(I) -증착온도를 중심으로-

  • Shin, Y.S. (Department of Metallurgical Engineering, Yonsei University) ;
  • Ha, S.H. (Department of Metallurgical Engineering, Yonsei University) ;
  • Kim, M.I. (Department of Metallurgical Engineering, Yonsei University)
  • 신영식 (연세대학교 공과대학 금속공학과) ;
  • 하선호 (연세대학교 공과대학 금속공학과) ;
  • 김문일 (연세대학교 공과대학 금속공학과)
  • Published : 1989.12.31

Abstract

To investigate the influence of temperature on the TiN film, it was deposited on the STC-3 steel and Si-wafer from $TiCl_4/N_2/H_2$ gas mixture by using the radio frequency plasma assisted chemical vapor deposition. The deposition was performed at temperature of $400^{\circ}C-500^{\circ}C$. The results showed that crystalline TiN film was deposited over $480^{\circ}C$, and all specimens showed the crystalline TiN X-ray diffraction peaks after vacuum heat treatment for 3 hrs, at $1000^{\circ}C$, $10^{-5}torr$. While the film thickness was increased above $480^{\circ}C$, it was decreased under $480^{\circ}C$ as temperature increased. And the contents of titanium were increased and it of chlorine were decreased as temperature increased. Because temperature increase was attributed to the increase in the density of TiN film, surface hardness of TiN film was increased with temperature.

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Acknowledgement

Supported by : (주) 통일