반도성 세라믹스용 무전해 니켈전극의 제조 및 특성

Preparation and Characteristics of Electroless Nickel Electrode for Semiconducting Ceramics

  • 윤기현 (한국과학기술원 무기재료연구실) ;
  • 박흥수 (연세대학교 요업공학과) ;
  • 윤상옥 (한국과학기술원 무기재료연구실) ;
  • 송효일 (삼성종합기술원 소재부품연구소)
  • 발행 : 1989.01.01

초록

Preparation and characteristics of electroless Ni-P and Ni-B systems for semiconducting ceramics have been investigated as a function of deposit rate, reducing agent and pH variation. The effect of DMAB as ruducing agent is greater than that of sodium hypophosphite. The nickel electrode prepared from the nickel-phosphorus system with sodium hypophosphite shows low contact resistance of 0.99ohm compared with the resistance of 10chm in the electrode prepared from the nickel-boron system with DMAB. The contact resistance increases with increasing pH valuein the nickel-phosphorus system with sodium hypophosphite. The ratio of Ni to P is about 76.0/24.0 for the contact resistance of 0.99ohm in the above system.

키워드

참고문헌

  1. Am. Ceram. Soc. Bull. v.39 no.6 Choice of Electrodes in Study and Use of Ceramic Semiconducting Oxide H.A.Sauer;S.S.Flaschen
  2. J. Phys. Soc. Japan v.14 no.9 Properties of Semiconductive Barium Titanates Osamu Saburi
  3. J. Appl. Phys. v.27 no.2 New Low Contact Resistance Electrode S.S.Flaschen;L.G.Van Uitert
  4. J. Electrochem. Soc. v.107 no.3 Ohmic contacts to Semiconductors D.R.Turner;H.A.Sauer
  5. Mat. Res. Bull. v.21 no.9 Complex-plane Impedance Analysis for Semiconducting Barium Titanates H.S.Maiti;R.N.Basu
  6. U.S.Pat. 3, 336, 160 Method of Making Contacts on Semiconductors S.Katz;O.Park;E.J.Miller
  7. U.S.Pat. 3, 480, 475 Method for Forming Electrode in Semiconductor Devices M.Inoue;G.Kano;Suita. shi;J.Matsuno;S.Takayanagi
  8. J. Electrochem. Soc. v.115 no.5 Electroless Nickel Plating on Silicon H.Iwasa;M.Yokozawa;I.Teramoto
  9. J. Am. Ceram. Soc. v.48 no.10 Electrode Effects on Semiconducting Titanate Ceramics R.Sussmann;V.Ern
  10. J. Electrochem. Soc. v.118 no.7 The Use of Plated Metal Films for Semiconductor Oxide Parameter Measurement D.L.Cannon
  11. Solid State Tech. v.16 no.12 Electroless Plating in The Semiconductor Industry N.Feldstein
  12. Denki Kagaku v.44 no.6 Studies on An Electroless Nickel Plating Bath with Dimethylamine Borane as The Reducing Agent K.Nihei;T.Ohsaka;H.Sawai
  13. J. Electrochem. Soc. v.115 no.1 The Nucleation, Growth and Structure of Thin Ni-P Films J.P.Marton;M.Schlesinger
  14. U.S.Pat. 3, 586, 534 Ohmic Contact Electrode to Semiconducting Ceramics and a Method for Making the Same T.Nitta;A.Kuito
  15. Doposition Technologies for Films and Coating R.F.Bunshah
  16. Solid-State Comm. v.64 no.4 Contact Resistance of the Electrode on Semiconducting Ceramics S.O.Yoon;H.J.Jung;K.H.Yoon
  17. J. Phys. Chem. Solids v.30 no.2657 Study of Solid Electrolyte Polarization by a Complex Admittance Method J.E.Bauerle
  18. Denki Kagaku v.44 no.10 Studies on Electroless Nickel Plating Bath with Dimethylamine Borane as The Reducing Agent and The Properties of The Deposits K.Nihei;T.Ohsaka;H.Sawai
  19. Metal Finishing v.84 no.10 Electroless Nickel-Phosphorus-Boron Alloy Coatings C.K.Mital;F.B.Shrivastava
  20. J. Phys. Chem. Solids v.45 no.10 Ceramic Sensors and Transducers B.M.Kulwicki