A STUDY ON THE TENSILE BOND STRENGTH OF ETCHED BASE METALS

식각된 비 귀금속 합금과 법랑질간의 접착 인장강도에 대한 연구

The purpose f this study was to evaluate the effect of resin film thickness on the tensile bond strength and to compare the tensile bond strengths of 4 differently treated metal surfaces. For the experiment, seventy metal specimens were cast with Verabond and divided into I, II, III, groups. The metal specimens in group I were electrolytically etched and cemented with Panavia under finger pressure. Cement film thickness was regulated with metal spacers. The metal specimens in Group II were treated by 4 methods, such as electrolytic etching method, salt-roughened method, EZ-oxisor method , chemical etching method and cemented with Panavia. In group III, electrolytically etched metal specimens were cemented with Hy-Bond. The etched surface of metal specimens and the cement film thickness were examined under the scanning electron microscope. Results were as follows; 1. The tensile bond strength showed no significant difference between $30{\mu}m,\;80{\mu}m,\;130{\mu}m$ film thicknessspecimens. 2. There was no significant difference in the tensile bond strength between the 4 differently treated metal specimens. 3. The tensile bond strength showed significant difference between Panavia and Hy-Bond. 4. Scanning electron microscope photograph revealed that tile interdendritic eutectic was removed in electrolytically etched metal surfaces hilt even dendritic arm was removed in Chemically etched metal surfaces. 5. The metal surfaces which were air-abraded with $50{\mu}m$ aluminum oxide showed roughness and small crack on scanning electron microscope photograph.