The Correlation between the Ultrasonic Backscattered Energy and the Applied Stress in Al material

Al재료(材料)에서 Ultrasonic Backscattered Energy와 Stress와의 상호관계(相互關係)

As a new device of stress monitoring method, ultrasonic backscattering method has been used to aluminium samples with various grain sizes at rayleigh critical angle in order to observe the relationships between applied stress and ultrasonic backscattered energy. It was found that the ultrasonic backscattered energy was observed to decrease as the grain size increased at the given applied stress. At the same grain size, the ule ultrasonic backscattered energy increased with increasing the applies stress. Through this study, we provided some possibility to evaluate stresses in materials under loads nondestructively, and this method is expected to be used as a new stress monitoring device.