Abstract
To investigate the bond strength of etched porcelain, porcelain specimens were etched by 5% hydrofluoric acid during the time of 2.5 min., 5 min., 7.5 min., and 10 min. at $23^{\circ}C$ and observed by SEM. Also, electrolytically etched metal was observed by SEM. Etched porcelain specimens were treated or were not treated with Silane coupling agent and bonded to etched metals with Comspan and Panavia. The bonded specimens were stored in water at $37^{\circ}C$. 24 hours after bonding, the bond strengths were measured. There were four groups of 25 specimens each. Group 1 was bonded with Panavia. Group 2 was bonded with Panavia after treated with Silane coupling agent. Group 3 was bonded with Comspan, Group 4 was bonded with Comspan after treated with Silane coupling agent. The results were as follows: 1. he etched porcelains were obviously observed by SEM. 2. The dendritic arms were observed in etched metal by SEM. 3. The bond strength in relation to the increase of etching time increased and an analysis of variance shows significantly different at the 0.01 level in all groups. 4. The bond strength of Silane coupling agent treated groups were higher than the untreated. 5. The ratios of increase of the bond strengths of Silane coupling agent treated groups in relation to the increase of etching of etching time were lower than the untreated. 6. The bond strength of the groups used Comspan were higher than Panavia.