Journal of Surface Science and Engineering (한국표면공학회지)
- Volume 18 Issue 4
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- Pages.153-163
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- 1985
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Depositing Rate of Electroless Nickel Plating Bath Contained Triethanolamine as a Complexing Agent
트리에탄올아민을 錯化劑로 사용한 無電解니켈鍍金浴의 析出速度에 관한 硏究
- Yeo, Woon-Kwan (Dept. of Metallurgical Engineering Hong Ik Technical College)
- 여운관 (홍익공업전문대학 금속공학과)
- Published : 1985.12.01
Abstract
In the electroless nickel plating bath which contained nickel sulfate, sodium hypophosphite, boric acid and triethanolamine, effect of their concentration on the rate of deposition was tested by gravimetric method and polarization method. The polarization method that polarize small range of voltage anodicaly and cathodicaly at the mixed potential in the electroless plating bath can calculate mixed current (depositing rate) from
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