80Ni-20Fe Permalloy 박모 동시석출 기구에 관한 전기화학적 고찰

An Electrochemical Analysis on the Alloy Deposition of 80Ni-20Fe Permalloy Thin Film

  • 이경호 (서울대 공과대학 금속공학과 대학원) ;
  • 강탁 (서울대 공과대학 금속공학과 대학원) ;
  • 라형용 (서울대 공과대학 금속공학과)
  • Lee, K. H. (Graduate School S.N.U.) ;
  • Kang, Tak (Graduate School S.N.U.) ;
  • Ra, H. Y. (Faculty, College of Eng. S.N.U.)
  • 발행 : 1982.03.01

초록

80% Ni-Permalloy is soft magnetic material with high initial permeability and low magnetic coercive force Hc, and is used to computer memory cores and minirelays of communication e-ngineering. In this paper 80 Permalloy thin film on copper cathode was alloy-deposited from Watts so-lution contatining FeSO4$.$7H2O. The amount of FeSO4$.$7H2O in the solution, pH, temperature of the solution and plating current density were varied as parameters and the resulting comp-osition changes of deposited film were analyzed electrochemically with respect to the parame-ters. From the above procedure electroplating conditions for deposition of 80 Permalloy were est-ablished as following: 17-21 g/$\ell$ of FeSO4$.$7H2O in Watts solution, current density 1.0-2.0 Amp/dm2, pH 2.5-3.0 and temperature range of 50-60$^{\circ}C$.

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