Journal of Surface Science and Engineering (한국표면공학회지)
- Volume 1 Issue 1
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- Pages.5-13
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- 1967
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Rapid Determination of Electroplating Solutions (1) -Copper from Copper Plating Solutions
각종 도금액의 신속분석법 (제 1 보)
Abstract
Up to this date, numerous methods of analysis of electropling solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelop countries, technicians of electroplating shops are most high school graduates or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equipment . Therefore, in this paper the simplest, besides accurate method is investigated after comparing numerous methods published. Among the methods of copper determinations from acid and alkaline copper plating baths, EDTA titration method are chosen, due to these methods are the simpest and fastest for the evaluation of metal content, without requirng any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of indicators and other metal's coexisitence as well as solution component, many difficulties were encountered from cyanide copper, on the contrary of acid copper bath. PAN , PV, and MX indicators were tried , but it is found that MX is the best. In chyanide solution ,due to cyanide is the masking reagent , elimination of this component is essential , and finally found that elimination CN-by precipitation with AgNO
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