과제정보
이 논문은 2024 년도 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원(RS-2023-00277326), 정부(과학기술정보통신부)의 재원으로 정보통신기획평가원의 지원 (No.RS-2023-00277060, 개방형 엣지 AI 반도체 설계 및 SW 플랫폼 기술개발), 2024 년도 BK21 FOUR 정보기술 미래인재 교육연구단에 의하여 지원, 반도체 공동연구소 지원, 2023 년도 정부(과학기술정보통신부)의 재원으로 정보통신기획평가원의 지원(IITP-2023-RS-2023-00256081), 반도체 공동연구소 지원을 받아 수행된 연구임.
참고문헌
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