A Study on Optimal Selection of Heak Sinks Through Thermal Analysis of Switching Devices

스위치 열해석을 통한 최적 방열판 선정 방안에 관한 연구

  • Published : 2016.11.25

Abstract

This paper is studied on optimal selection of heat sink for power electronics devices according to switching conditions. Through thermal analysis of MOSFET and repeated digital simulation, the loss characteristics during both switching and conduction intervals are compared to volume of the heat sinks. As a result, heat sink larger by 25% in volume could radiate more heat about $19^{\circ}C$.

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