한국진공학회:학술대회논문집 (Proceedings of the Korean Vacuum Society Conference)
- 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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- Pages.244.1-244.1
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- 2016
Reliability of metal films on flexible polymer substrate during cyclic bending deformations
- Published : 2016.02.17
Abstract
Recently, the technology for flexible electronics such as flexible smart phone, foldable displays, and bendable battery is under active development. With approaching the real commercialization of flexible electronics, the electrical and mechanical reliability of flexible electronics have become significantly important because they will be used under various mechanical deformations such as bending, twisting, stretching, and so on. These mechanical deformations result in performance degradation of electronic devices due to several mechanical problems such as cracking, delamination, and fatigue. Therefore, the understanding of relationship between mechanical loading and electrical performance is one of the most critical issues in flexible electronics for expecting the lifetime of products. Here, we have investigated the effect of monotonic tensile and cyclic deformations on metal interconnect to provide a guideline for improving the reliability of flexible interconnect.