Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 2015.11a
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- Pages.232-233
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- 2015
Effect of bath conditions and pulse parameters on tin surface finish for microelectronic packaging applications
Abstract
The effects of various bath conditions such as surfactant concentration, bath pH, bath temperature, agitation of bath; as well as pulse parameters such as cathodic current density, pulse duty cycle and frequency, on the grain size, surface finish, and appearance of the tin plated coatings have been investigated. The plating bath under investigation is an aqueous acidic solution composed of a mixture of
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