Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2011.07a
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- Pages.1684-1685
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- 2011
Numerical Analysis for Thermal Isolation on Plasma Etched silicon micro-structures
DRIE 식각을 이용한 대면적 실리콘 미세 구조물 부유 시 발생하는 열고립 현상 해석
- Lee, Yong-Seok (Department of Electrical Engineering and Computer Science Seoul National University) ;
- Jang, Yun-Ho (Department of Electrical Engineering and Computer Science Seoul National University) ;
- Kim, Jung-Mu (Department of Electronic Engineering Chonbuk National University) ;
- Kim, Yong-Kweon (Department of Electrical Engineering and Computer Science Seoul National University)
- Published : 2011.07.20
Abstract
This paper presents a theoretical and numerical analysis for thermal isolation of silicon micro-structures, especially for a large size with poor thermal conductivity, as well as straightforward solution for such an issue. Additional metal patterns underneath the silicon structures effectively reduces the thermal isolation. Heat transfer mechanism is analyzed using an equivalent circuit of thermal network including plasma, a heat source, heat capacitors, and thermal resistances. The FEM simulation was carried out to investigate the temperature change of silicon micro-structures according to process time. The temperature of silicon micro-structures with 2
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