Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Implementation of a through-silicon microlens array using glass reflow

유리 리플로를 이용한 실리콘-관통형 마이크로렌즈 어레이의 구현

  • Yoo, Seung-Hyun (Department of Electrical Engineering and Computer Science, Seoul National University) ;
  • Ha, Joon-Geun (Department of Electrical Engineering and Computer Science, Seoul National University) ;
  • Jin, Joo-Young (Department of Electrical Engineering and Computer Science, Seoul National University) ;
  • Ji, Chang-Hyeon (Department of Electronics Engineering, Ewha Womans University) ;
  • Kim, Yong-Kweon (Department of Electrical Engineering and Computer Science, Seoul National University)
  • 유승현 (서울대학교 전기.컴퓨터공학부) ;
  • 하준근 (서울대학교 전기.컴퓨터공학부) ;
  • 진주영 (서울대학교 전기.컴퓨터공학부) ;
  • 지창현 (이화여자대학교 전자공학과) ;
  • 김용권 (서울대학교 전기.컴퓨터공학부)
  • Published : 2011.07.20
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Abstract

Through-silicon microlens array has been implemented using glass thermal reflow process. Design, numerical analysis, fabrication, and measurement results are discussed. Microlenses with six different volumetric dimensions were successfully fabricated and characterized. Radius of curvature of each microlenses were measured with less than 1% deviation compared to calculated value. Measured average roughness of the microlens surface was 16.5 nm.

Keywords