Numerical Thermo-Fluid Analysis to the Water Cooling Plate

IGBT 스택용 10kW급 수냉각판 열유동 수치해석

  • 유성열 (LS산전, 중앙연구소 OI센터) ;
  • 목진성 (LS산전, 중앙연구소 OI센터) ;
  • 조태식 (LS산전, 전력연구소 자동차 전장 사업부) ;
  • 김철주 (성균관대학교 기계공학부)
  • Published : 2011.10.20

Abstract

The present study deals with the results of a thermo-fluid analysis applied to the cooling plate of the water cooling system developed for IGBT stacks, which was designed to keep the power semi-conductors from over heating problems. The cooling plate is to absorb a maximum quantity of 10kW from 4 IGBTs which are to be placed on both sides of the cooling plate, 2 IGBTs of them on each surface. For the analysis, Adina of CFD Program was used and an analysis was conducted to obtain the knowledges on heat and mass flow at both the plate and fluid flow inside. For the simulation, the operational conditions of a temperature difference of $15^{\circ}C$ for the working fluid and a uniform heat flux of about 92000 $W/m^2$ on the surface in contact with an IGBTs.

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