Proceedings of the Korean Vacuum Society Conference (한국진공학회:학술대회논문집)
- 2011.02a
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- Pages.334-334
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- 2011
Temperature cycling test of Cu films on anodized aluminum substrate of metal-PC application
Abstract
We applied N-ion bombardment and heat treatment to the Cu thin films deposited on aluminum oxide layer for the enhancement of adhesion. With e-beam evaporation method.