대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2009년 추계학술발표대회
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- Pages.59-59
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- 2009
Influences of boron and silicon in insert alloys on microstructure and isothermal solidification during TLP bonding of a duplex stainless steel using MBF-35 and MBF-30
- Yuan, Xinjian (Department of Materials Science and Engineering, Pusan National University) ;
- Kim, Myung-Bok (National Core Research Center (NCRC) for Hybrid Material Solution, Pusan National University) ;
- Kang, Chung-Yun (Department of Materials Science and Engineering, Pusan National University)
- 발행 : 2009.11.26
초록
The influences of B and Si in the filler metals on microstructure and isothermal solidification during transient liquid-phase (TLP) bonding of a nitrogen-containing duplex stainless steel with MBF-30 (Ni-4.5wt.%Si-3.2wt.%B) and MBF-35 (Ni-7.3wt.%Si-2.2wt.%B), were studied at the temperature range of