Proceedings of the Korean Geotechical Society Conference (한국지반공학회:학술대회논문집)
- 2009.03a
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- Pages.571-578
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- 2009
Development of New Micropiling Technique and Field Installation
신개념 마이크로파일 개발 및 현장시험시공
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Choi, Chang-Ho
(Earth&Foundation Engr. Div. Korea Institute of Construction Technology) ;
- Goo, Jeong-Min (Earth&Foundation Engr. Div. Korea Institute of Construction Technology) ;
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Lee, Jung-Hoon
(Geotechnical Engineering Research Department, Korea Institute of Construction Technology) ;
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Cho, Sam-Deok
(Earth&Foundation Engr. Div. Korea Institute of Construction Technology) ;
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Jeong, Jae-Hyeong
(Earth&Foundation Engr. Div. Korea Institute of Construction Technology)
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최창호
(한국건설기술연구원 토질및기초연구실) ;
- 구정민 (한국건설기술연구원 토질및기초연구실) ;
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이정훈
(한국건설기술연구원 지반연구부) ;
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조삼덕
(한국건설기술연구원 토질및기초연구실) ;
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정재형
(한국건설기술연구원 토질및기초연구실)
- Published : 2009.03.27
Abstract
Recently, micropiling techniques are increasingly applied in foundation rehabilitation/underpinning and seismic retrofitting projects where working space provides the limited access for conventional piling methods. Micropiling techniques provide environmental-friendly methods for minimizing disturbance to adjacent structures, ground, and the environment. Its installation is possible in restrictive area and general ground conditions. The cardinal features that the installation procedures cause minimal vibration and noise and require very low ceiling height make the micropiling methods to be commonly used for underpin existing structures. In the design point of view, the current practice obligates the bearing capacity of micropile to be obtained from skin friction of only rock-socketing area, in which it implies the frictional resistance of upper soil layer is ignored in the design process. In this paper, a new micropiling method and its verification studies via field installation are presented. The new method provides a specific way to grout bore-hole to increase frictional resistance between surrounding soil and pile-structure and it allows to consider the skin friction of micropiles for upper soil layer during design process.