대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2009년도 제40회 하계학술대회
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- Pages.1609_1610
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- 2009
COB 패키지 설계를 위한 PCB 배선기판의 열특성 분석
Analysis of Heat Emission Properties of Printed Circuit Boards For COB Package
- Kim, Min-Sung (Chonnam National University) ;
- Kim, Jin-Hong (Chonnam National University) ;
- Yeo, In-Seon (Chonnam National University) ;
- Kim, Young-Woo (Koea Photonics Technology Institute) ;
- Park, Sung-Mo (Koea Photonics Technology Institute) ;
- Song, Sang-Bin (Koea Photonics Technology Institute)
- 발행 : 2009.07.14