대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2009년도 제40회 하계학술대회
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- Pages.1551_1552
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- 2009
집적화된 CMOS 센서의 팩키징 연구 및 특성 평가
The Study and characteristics of integrated CMOS sensor's packaging
- Roh, Ji-Hyoung (Korea University) ;
- Kwon, Hyeok-Bin (Dan-Kook University) ;
- Shin, Kyu-Sik (Korea Electronics Technology Institute) ;
- Cho, Nam-Kyu (Korea Electronics Technology Institute) ;
- Moon, Byung-Moo (Korea University) ;
- Lee, Dae-Sung (Korea Electronics Technology Institute)
- 발행 : 2009.07.14
초록
In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.
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