대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 2008년도 하계종합학술대회
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- Pages.551-552
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- 2008
Wire-bonding의 길이 변화에 따른 주파수별 특성 분석
Analysis of Frequency Response Depending on Wire-bonding Length Variation
- 권은진 (전자소재 패키징 연구센터 전자부품연구원) ;
- 문종원 (전자소재 패키징 연구센터 전자부품연구원) ;
- 류종인 (전자소재 패키징 연구센터 전자부품연구원) ;
- 박세훈 (전자소재 패키징 연구센터 전자부품연구원) ;
- 김준철 (전자소재 패키징 연구센터 전자부품연구원)
- Gwon, Eun-Jin (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Mun, Jong-Won (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Ryu, Jong-In (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Park, Se-Hoon (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Kim, Jun-Chul (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute)
- 발행 : 2008.06.18
초록
This paper presets a results of frequency response in variation of wire bonding length. A gold ball bonding is used as a wire bonding process, and a DPDT(double pole double thru) switch is adapted as a device for test. Wire length is ranged from 442um to 833um and a measured frequency range is from 1 GHz to 6 GHz. Little difference are measured in insertion loss and return loss depending on wire length. Measured S21 and S11 are -0.58 dB and -17.7 dB, respectively. S21 insertion loss is rising up and S11 insertion loss is falling down as the frequency is increased.
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