Proceedings of the Korean Society for Technology of Plasticity Conference (한국소성가공학회:학술대회논문집)
- 2008.10a
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- Pages.414-417
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- 2008
Estimation of Design Variables for Improving the Bonding Force of Lid & Frame for Cellular Phone
휴대폰용 리드 앤 프레임의 접합력 향상을 위한 설계 변수 평가
Abstract
A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame Bonding force of this part have to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variable of lid & frame on its debonding force. Estimations were performed by finite element method.