Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Product and Properties of Embedded Capacitor by Aerosol Deposition

Aerosol Deposition에 의한 Embedded Capacitor의 제조 및 특성 평가

  • Yoo, Hyo-Sun (Electronic Materials and Packaging Research Center, Korean Electronic Technology Institute(KETI)) ;
  • Cho, Hyun-Min (Electronic Materials and Packaging Research Center, Korean Electronic Technology Institute(KETI)) ;
  • Park, Se-Hoon (Electronic Materials and Packaging Research Center, Korean Electronic Technology Institute(KETI)) ;
  • Lee, Kyu-Bok (Wireless Components and Telecommunication Research Center, KETI) ;
  • Kim, Hyeong-Joon (Department of Materials Science and Engineering, Seoul National Univ.)
  • 유효선 (전자부품연구원 전자소재패키징연구센터) ;
  • 조현민 (전자부품연구원 전자소재패키징연구센터) ;
  • 박세훈 (전자부품연구원 전자소재패키징연구센터) ;
  • 이규복 (전자부품연구원 무선통신부품연구센터) ;
  • 김형준 (서울대학교 재료공학부)
  • Published : 2008.06.19
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Abstract

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

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