Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.06a
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- Pages.270-270
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- 2008
High density line patterns fabricated by thermal imprint
Thermal imprint를 이용한 고밀도 line패턴 형성방법
- Lee, Sang-Moon (Central R&D, Samsung Electro-Mechanics) ;
- Kwak, Jung-Bok (Central R&D, Samsung Electro-Mechanics) ;
- Lee, Hwan-Soo (Central R&D, Samsung Electro-Mechanics)
- Published : 2008.06.19
Abstract
We present details of experimental results in the fabrication of high density line patterns, using imprint technique that can provide a simple and comparatively cost-effective manufacturing means. Barrier array structures for display or interconnects for semiconductor applications were the aims of this study. For pattern fabrication, a polymer layer (Ajinomoto GX-13 dielectric film) with a thickness of 38um that can act as either an insulating or a dielectric layer was laminated on a substrate. Fine tracks were then formed using a patterned stamp under isostatic pressure. The line width was ranged between 10 to 60 mm. A self-assembled monolayer (SAM) of fluorinated alkylchlorosilane [