Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Effect of copper surface to $HNO_3$ electrolyte

$HNO_3$ 전해액이 Cu 표면에 미치는 영향

  • Park, Sung-Woo (Department of Electrical Engineering, Chosun University) ;
  • Han, Sang-Jun (Department of Electrical Engineering, Chosun University) ;
  • Lee, Young-Kyun (Department of Electrical Engineering, Chosun University) ;
  • Lee, Woo-Sun (Department of Electrical Engineering, Chosun University) ;
  • Seo, Yong-Jin (Department of Electrical Engineering, Daebul University)
  • Published : 2008.06.19
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Abstract

본 논문에서는 Cu의 ECMP 적용을 위해 $HNO_3$ 전해액의 active, passive, transient, trans-passive 영역을 I-V 특성 곡선을 통해 알아보았고, LSV (Linear sweep voltammetry)와 CV (Cyclic voltammetry)법을 통하여 전기화학적 특성을 비교 분석하였다.

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