Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.11a
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- Pages.158-158
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- 2008
An Integrated Evaporation Intenna used sputtering technology for Wireless Microsystems
- Park, Book-Sung (School of Electrical and Computer Engineering, University of Seoul) ;
- Jung, In-Sung (School of Electrical and Computer Engineering, University of Seoul) ;
- Kwon, Sung-Hun (School of Electrical and Computer Engineering, University of Seoul) ;
- Lee, Seon-Gu (Overseas HSDPA Development Group) ;
- Lee, Jee-Myun (Overseas HSDPA Development Group) ;
- Son, Sung-Il (Overseas HSDPA Development Group) ;
- Kim, Eun-Tae (High-speed User Equipment Modem Research Team, ETRI) ;
- Kim, Chul-Ju (School of Electrical and Computer Engineering, University of Seoul)
- Published : 2008.11.06
Abstract
In general, a wireless communication device has employed a whip antenna or a stubby antenna. Recently, wireless communication device is increasingly employing an embedded antenna, Intenna, for the sake of miniaturization. Further, it may employ both external and embedded antennas. Examples of the embedded antenna include a multi-band monopole antenna, which radiates uniformly in all directions when viewed from above, and a planar inverted F antenna (PIFA), which is a variation of the monopole antenna. However, since the conventional antenna is mounted in a finished state on the mobile communication terminal, there is a limitation of space required for providing the antenna. According to the present study, there is provided an Intenna that is deposited on a front or back case of the mobile communication terminal by a sputtering method. Accordingly, it is possible to overcome a limitation of space required for providing the Intenna and to improve the performance of the Intenna formed on the front or back case of the mobile communication terminal.