Proceedings of the Korean Institute of Information and Commucation Sciences Conference (한국정보통신학회:학술대회논문집)

The Korea Institute of Information and Commucation Engineering (한국정보통신학회)
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Vertical Via Transition Using a Coaxial Line for SMT Pad Applications

  • Lee, Young-Chul (Division of Marine Electronics and Communication Engineering, Mokpo National University)
  • Published : 2008.10.31
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Abstract

In this paper, a vertical via transition using a coaxial line is presented for LTCC SMT package applications. A part of outer conductor is cut off due to overlap between a CPW on PCB and transition. For reduction of radiation and return path, a cap is designed on the top layer. The measured S11 and S21 are -14 and 0.9dB, respectively at 15GHz.

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