A Study on Cooling for High Thermal Density Electronics Using Heat Sink and Heat Spreader

히트싱크 및 히트 스프레더를 이용한 고밀도 발열 전자부품의 방열 구조에 관한 연구

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.