Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2008.11b
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- Pages.2137-2143
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- 2008
A STUDY ON HEAT TRANSFER THROUGH THE FIN-WICK STRUCTURE MOUNTED IN THE EVAPORATOR FOR A PLATE LOOP HEAT PIPE SYSTEM
- Nguyen, Xuan Hung (School of Mechanical Engineering Sungkyunkwan University) ;
- Sung, Byung-Ho (School of Mechanical Engineering Sungkyunkwan University) ;
- Choi, Jee-Hoon (School of Mechanical Engineering Sungkyunkwan University) ;
- Yoo, Jung-Hyung (R&D Center, Zalman Tech Co., Ltd.) ;
- Seo, Min-Whan (R&D Center, Zalman Tech Co., Ltd.) ;
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Kim, Chul-Ju
(School of Mechanical Engineering Sungkyunkwan University)
- Published : 2008.11.05
Abstract
This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.