대한기계학회:학술대회논문집 (Proceedings of the KSME Conference)
- 대한기계학회 2008년도 추계학술대회B
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- Pages.2043-2052
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- 2008
비등 촉진 마이크로 구조물을 이용한 휴대용 컴퓨터 냉각시스템의 열성능에 관한 연구
Thermal Performance of Cooling System for a Laptop Computer Using a Boiling Enhancement Microstructure
- 발행 : 2008.11.05
초록
The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at
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