대한기계학회:학술대회논문집 (Proceedings of the KSME Conference)
- 대한기계학회 2008년도 추계학술대회A
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- Pages.1277-1282
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- 2008
Navigation Connection용 ACF(Anisotropic Conductive Film)의 수명 예측
Lifetime Estimation of an ACF in Navigation
- 발행 : 2008.11.05
초록
Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.
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