대한기계학회:학술대회논문집 (Proceedings of the KSME Conference)
- 대한기계학회 2008년도 추계학술대회A
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- Pages.1265-1270
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- 2008
Electromigration 고장에 의한 Amplifier IC의 수명 예측
Lifetime Estimation of Amplifier IC due to Electromigration failure
- 발행 : 2008.11.05
초록
Electromigration is a one of a critical failure mechanism in microelectronic devices. Minimizing the thin film interconnections in microelectronic devices make high current densities at electrrical line. Under high current densities, an electromigration becomes critical problems in a microelectronic device. This phenomena under DC conditions was investigated with high temperature. The current density of 1.5MA/cm2 was stressed in interconnections under DC condition, and temperature condition
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