Proceedings of the Korean Society for Noise and Vibration Engineering Conference (한국소음진동공학회:학술대회논문집)
- 2008.11a
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- Pages.364-367
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- 2008
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- 1598-2548(pISSN)
Vibration Analysis of ultrasonic Horn for Flip-Chip Bonding
플립칩 접합용 초음파 혼의 진동해석
- Published : 2008.11.20
Abstract
Finite element model and the basic experimental method have been developed to help the design of the transverse ultrasonic horn for flip-chip bonding. With two types of design the horn performance and ultrasonic characteristics are verified by using laser vibrometer. These analysis and experiment results can be the fundamental data for ultrasonic horn design considering the vibration modes and performance.