Proceedings of the Korean Society for Noise and Vibration Engineering Conference (한국소음진동공학회:학술대회논문집)

  • 2008.11a
  • /
  • Pages.364-367
  • /
  • 2008
  • /
  • 1598-2548(pISSN)
The Korean Society for Noise and Vibration Engineering (한국소음진동공학회)
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Vibration Analysis of ultrasonic Horn for Flip-Chip Bonding

플립칩 접합용 초음파 혼의 진동해석

  • 김일광 (서울대학교 대학원 기계정보공학과) ;
  • 홍상혁 (서울시립대학교 기계정보공학과) ;
  • 이수일 (서울시립대학교 기계정보공학과)
  • Published : 2008.11.20
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Abstract

Finite element model and the basic experimental method have been developed to help the design of the transverse ultrasonic horn for flip-chip bonding. With two types of design the horn performance and ultrasonic characteristics are verified by using laser vibrometer. These analysis and experiment results can be the fundamental data for ultrasonic horn design considering the vibration modes and performance.

Keywords