Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2007.11a
- /
- Pages.218-221
- /
- 2007
Processing Control of 0402 Chip used Pb-free Solder in SMT process
무연솔더 적용한 0402 칩의 공정제어
Abstract
The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of