Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2007.06a
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- Pages.49-49
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- 2007
Sintering and Dielectric Properties of LTCC Zero Shrinkage Substrate by Glass Infiltration
Glass Infiltration법에 의한 LTCC 무수축 기판의 소결특성 및 유전특성
- You, Jung-Hun (Dept. of Materials Science and Engineering, Korea University) ;
- Yeo, Dong-Hun (System Module Team, Fusion Technology Division, Korea Institute of Ceramic Eng. & Tech.) ;
- Shin, Hyo-Soon (System Module Team, Fusion Technology Division, Korea Institute of Ceramic Eng. & Tech.) ;
- Kim, Hyo-Tae (System Module Team, Fusion Technology Division, Korea Institute of Ceramic Eng. & Tech.) ;
- Kim, Jong-Hee (System Module Team, Fusion Technology Division, Korea Institute of Ceramic Eng. & Tech.) ;
- Yoon, Ho-Gyu (Dept. of Materials Science and Engineering, Korea University)
- 유정훈 (고려대학교 신소재공학부) ;
- 여동훈 (요업기술원 융복합기술본부 시스템모듈팀) ;
- 신효순 (요업기술원 융복합기술본부 시스템모듈팀) ;
- 김효태 (요업기술원 융복합기술본부 시스템모듈팀) ;
- 김종희 (요업기술원 융복합기술본부 시스템모듈팀) ;
- 윤호규 (고려대학교 신소재공학부)
- Published : 2007.06.21
Abstract
Glass infiltration 방법을 이용하여 '
Keywords