대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

유기 패키징 기판에서의 BTO 기반의 임베디드 MIM 커패시터의 특성 분석

Characterization of BTO based MIM Capacitors Embedded into Organic Packaging Substrate

  • 이승재 (마이크로/나노 소자 및 패키징 연구실, 전자공학과, 광운대학교) ;
  • 이한성 (대덕전자) ;
  • 박재영 (마이크로/나노 소자 및 패키징 연구실, 전자공학과, 광운대학교)
  • Lee, Seung-J. (Micro/Nano Devices & Packaging Lab, Department of Electronic Engineering, Kwangwoon) ;
  • Lee, Han-S. (Daeduck Electronics) ;
  • Park, Jae-Y. (Micro/Nano Devices & Packaging Lab, Department of Electronic Engineering, Kwangwoon)
  • 발행 : 2007.07.18
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초록

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

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