반응성 플라즈마를 이용한 태양전지용 Si기판의 표면 처리

Surface treatment of Si wafer for solar cell using reactive plasma method

To lower the fabrication cost of silicon solar cells, a surface treatment using a dielectric barrier discharge instead of a wet cleaning technique was examined on electrode surfaces on silicon solar cells. The fill factor obtained through measuring current-voltage characteristics was evaluated, and the treated surface state was characterized by energy-dispersive X-ray. It was found that the dielectric barrier discharge effectively activated the electrode surface and the surface treatment on finger electrodes contributed greatly to improve the fill factor.