대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)

대한전자공학회 (The Institute of Electronics and Information Engineers)
권호 표지

MCM-D 기판 공정 기술을 이용한 V-Band Filter 구현

Implementation of V-Band Filter using MCM-D Technology

  • 유찬세 (전자부품연구원 전자소재패키징 연구센타) ;
  • 송생섭 (서울대학교 전기컴퓨터 공학부) ;
  • 박종철 (전자부품연구원 전자소재패키징 연구센타) ;
  • 서광석 (서울대학교 전기컴퓨터 공학부)
  • Yoo, Chan-Sei (Electronic Materials & Packaging Research Center Korea Electronics Technology Institute) ;
  • Song, Sang-Sub (Electronic Materials & Packaging Research Center Korea Electronics Technology Institute) ;
  • Park, Jong-Chul (Electronic Materials & Packaging Research Center Korea Electronics Technology Institute) ;
  • Seo, Kwang-Seok (Electronic Materials & Packaging Research Center Korea Electronics Technology Institute)
  • 발행 : 2006.06.21
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초록

A band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was $4{\times}10^7S/m$. The insertion loss of band pass filter at 60 GHz was 3.0 dB and group delay was below 0.1 ns.

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