나노임프린팅 공정을 위한 점착방지막 형설

Preparation of Antistiction Coatings for Nanoimprinting

  • 차남구 (한양대학교 재료화공학부 마이크로바이오칩센터) ;
  • 박창화 (한양대학교 재료화공학부 마이크로바이오칩센터) ;
  • 김규채 (한양대학교 재료화공학부 마이크로바이오칩센터) ;
  • 박진구 (한양대학교 재료화공학부 마이크로바이오칩센터)
  • 발행 : 2006.05.11

초록

Nanoimprint lithography (NIL) is a novel method to fabricate nanometer scale patterns. It is a simple process with low cost, high throughput and high resolution. NIL process creates patterns by the mechanical deformation of imprint resist and physical contact process. This physical contact process causes the stiction between the resist and the stamp. Stiction becomes a key issue especially in the stamps including narrow pattern size and wide area during NIL process development. The antistiction layer coating using fluorocarbon is very effective to prevent this problem and ensure successful NIL. In this paper, the concept of antistiction coating is explained and different preparation methods for nanoimprinting are briefly discussed.

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