Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 2006.04a
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- Pages.144-144
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- 2006
Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper layer laminate
Cu/80Ni20Cr/PI계 FCCL에서의 PI의 플라즈마 전처리에 따른 부착력의 영향
- Published : 2006.04.01
Abstract
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