대한설비공학회:학술대회논문집 (Proceedings of the SAREK Conference)
- 대한설비공학회 2006년도 동계학술발표대회 논문집
- /
- Pages.107-107
- /
- 2006
핀-휜 형상에 따른 전자기기의 공기냉각 열전달성능의 영향
The Effect of Shapes of Pin-Fins of an Air Cooling Module on the Heat Transfer Performance for Electronic Packaging Applications
- Heo, Kyeon (School Mechanical Engineering, Yeungnam University) ;
- Park, Joon-Beom (School Mechanical Engineering, Yeungnam University) ;
- Shin, Seok-Won (School Mechanical Engineering, Yeungnam University) ;
- Kim, Soo-Youn (School Mechanical Engineering, Yeungnam University)
- 발행 : 2006.11.24