Proceedings of the SAREK Conference (대한설비공학회:학술대회논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
권호 표지

The Effect of Shapes of Pin-Fins of an Air Cooling Module on the Heat Transfer Performance for Electronic Packaging Applications

핀-휜 형상에 따른 전자기기의 공기냉각 열전달성능의 영향

  • Heo, Kyeon (School Mechanical Engineering, Yeungnam University) ;
  • Park, Joon-Beom (School Mechanical Engineering, Yeungnam University) ;
  • Shin, Seok-Won (School Mechanical Engineering, Yeungnam University) ;
  • Kim, Soo-Youn (School Mechanical Engineering, Yeungnam University)
  • 허견 (영남대학교 기계공학과) ;
  • 박준범 (영남대학교 기계공학과) ;
  • 신석원 (영남대학교 기계공학과) ;
  • 김수연 (영남대학교 기계공학과)
  • Published : 2006.11.24
Download PDF
⟨ Previous Next ⟩

Abstract

Keywords