자기 접속 프로세스에 대한 볼륨 입자 거동에 대한 수치해석 연구

Numerical Analysis of Fusible Filler Behavior for Self-Interconnection Process

The present article aims to develop a numerical method for numerical analysis of fusible filler behavior for self-interconnection process. The CIP(Cubic Interpolated Propagation) method is used for determination of interfaces and the CSF(Continuum Surface Force) model is adopted for evaluation of curvature. To validate these models, first, the present study performs the numerical simulation for a droplet formation and it simulates the interactions among fusible fillers inside resin under the operating condition. As a result, similar tendency is found compared to the experimental observation. This study would be a first step towards finding the optimum condition for self-interconnection process.