Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Solderability Evaluation and Reaction Properties of Sn-Ag-Cu Solders with Different Ag Content

Ag 함유량에 따른 Sn-Ag-Cu 솔더의 Solderability 및 반응 특성 변화

  • 유아미 (한국생산기술연구원, 정밀접합팀) ;
  • 이종현 (한국생산기술연구원, 정밀접합팀) ;
  • 강남현 (한국생산기술연구원, 정밀접합팀) ;
  • 김정한 (한국생산기술연구원, 정밀접합팀) ;
  • 김목순 (인하대학교, 신소재공학부)
  • Published : 2006.10.19
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Abstract

Solderability and reaction properties were investigated for four Pb-free alloys as a function of Ag contents; Sn-4.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, Sn-2.5Ag-0.5Cu, and Sn-1.0Ag-0.5Cu. The alloy of the lowest Ag content, i.e., Sn-1.0Ag-0.5Cu, showed poor wetting properties as the reaction temperature decreased to 230oC. Variation of Ag concentration in the Sn-xAg-0.5Cu alloy shifted exothermic peaks indicating the undercooling temperature in DSC curve. For the aging process at 170oC, the thickness of IMCs at the board-side solder/Cu interface increased with the Ag concentration.

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