Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2006.05a
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- Pages.661-662
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- 2006
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- 2005-8446(pISSN)
Research on Laser Soldering of Micro Solder-balls
마이크로 솔더볼의 레이저 솔더링에 관한 연구
Abstract
This research is on a laser soldering using the micro solder-balls used in flip chip packaging process. A laser source used in laser soldering is Nd:YAG laser(250W and 60W). Solder-balls of 100, 300,