Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Interfacial Reactions Between Au-20Sn Solder and Cu Substrate with or without ENIG plating layer

Eutectic Au-20Sn solder와 Cu/ENIG 기판과의 계면반응

  • 전현석 (성균관대학교 신소재공학과) ;
  • 윤정원 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Published : 2006.05.01
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Abstract

Eutectic Au-20Sn solder has been widely used for optoelectronic packages because of fluxless soldering process and thus are particularly valuable for many applications such as biomedical, photonic, and MEMS devices that can not use any flux. Also when good joint strength, superior resistance to corrosion, whisker-free, and good thermal conductivity are demanded, eutectic Au-20Sn solder can be satisfied with above-mentions best. In this study, we tried to know the interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer In the results, Au-Cu-Sn ternary phases were formed at the Au-20Sn/Cu substrate, and Au-Ni-Sn, Au-Ni-Cu-Sn phases were formed at the Au-20Sn/ENIG substrate.

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