Effect of Plasma Treatment on Adhesion Strength between Underfill and Substrate

플라즈마 처리에 따른 언더필과 기판 사이의 접착 강도에 관한 연구

The effects of plasma treatment on the surfaces of the FR-4 (Flame Resistant-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the underfills/FR-4 substrate and underfills/copper substrate are also studied. As experimental results, the plasma treatments of FR-4 and copper substrate surfaces yield several oxygen complexes in hydrophilic surfaces, which can play an important role in increasing the surface polarity, wettability, and adhesion characteristics of the underfills/substrates.